Product Change Notification
| Change Notification # |
|
13577 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of XFAB Texas Wafer Fab for NCP2890A Micro-Bumped Devices |
| Issue Date |
|
2004-08-24 |
| Affected Product Family |
|
ANALOG |
| Description |
|
This is a Final PCN (Product Change Notice) to notify customers of the qualifcation of the XFAB Texas wafer fab, located in Lubbock, Texas, as an additional source for the NCP2890A micro-bumped devices.
|
| Key Items Affected by Change |
|
Subcontractor Fab Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2004-10-24 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|