Product Change Notification
| Change Notification # |
|
13175 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Transfer and Qualification of Bare Die Packaging at the Seremban Die Sales Center of Excellence Site |
| Issue Date |
|
2003-12-11 |
| Affected Product Family |
|
ALL |
| Description |
|
This is the final notification that ON Semiconductor is qualifying our Seremban, Malaysia Die Sales Center of Excellence facility to inspect, saw and package bare die products in wafer form, ring pack, and tape and reel.
|
| Key Items Affected by Change |
|
Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2004-02-11 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|