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Product Change Notification

Change Notification #   13175
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Transfer and Qualification of Bare Die Packaging at the Seremban Die Sales Center of Excellence Site
Issue Date   2003-12-11
Affected Product Family   ALL
Description   This is the final notification that ON Semiconductor is qualifying our Seremban, Malaysia Die Sales Center of Excellence facility to inspect, saw and package bare die products in wafer form, ring pack, and tape and reel.
Key Items Affected by Change   Assembly Site
 
Key Milestones  
Effective Date:   2004-02-11
Sample Info:   Yes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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