Product Change Notification
| Change Notification # |
|
11945 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
3ld Dpak Single Gauge Leadframe Qual at Internal and External |
| Issue Date |
|
2001-10-09 |
| Affected Product Family |
|
ANALOG |
| Description |
|
ON Semiconductor would like to notify our valued customers that, in our ongoing effort to improve quality and manufacturing cycle times, we are pleased to announce that we have qualified a new Single Gauge leadframe for the 3 Lead DPAK package. The leadframe change will not effect the case outline of the 3 Lead DPAK package, and there has been no change in the electrical or thermal performance of devices using the new single gauge leadframe. The heatsink thickness will decrease from 35 mils to 20 mils using the new leadframe. The leadframe change will become effective on December 31st, 2001 in both ON's internal Seremban, Malaysia assembly and test site, and in our subcontractor PSI located in Manila, Phillipines.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2001-12-08 |
| Sample Info: |
|
No |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|