Product Change Notification
| Change Notification # |
|
11940 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Final Notification - Qualification of Alternate Assembly/Test Sites |
| Issue Date |
|
2001-10-09 |
| Affected Product Family |
|
ALL |
| Description |
|
As part of our Manufacturing Restructuring Program, ON Semiconductor is qualifying the following alternate assembly/test sites for our D2Pak, TO220 Clip and Waffle Pack Chip Sale Power Products currently produced in our Guadalajara, Mexico facility:
|
| Key Items Affected by Change |
|
Assembly/Test Sites |
| |
| Key Milestones |
|
| Effective Date: |
|
2001-12-08 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|