Product Change Notification
| Change Notification # |
|
11391 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
VHC1G Relayout & ESD Enhancement |
| Issue Date |
|
2001-05-07 |
| Affected Product Family |
|
LOGIC |
| Description |
|
ON Semiconductor is pleased to announce a new layout for the MC74VHC1G04 series of devices. This new layout improves HBM ESD from 1500V to 4000V and MM from 100V to 300V. There is no change to the circuit design, functionality, or electrical parameters, however the die size did decrease. The existing J86S mask design will be discontinued when the K55W is released to production.
|
| Key Items Affected by Change |
|
Die Shrink & Design Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2001-08-15 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|