Product Change Notification
| Change Notification # |
|
10399 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Wafer Fab Technology Change for Selected ECLinPS Devices |
| Issue Date |
|
2000-11-15 |
| Affected Product Family |
|
BROADBAND |
| Description |
|
In order to better serve our customers, ON Semiconductor will increase wafer capacity by redesigning selected ECLinPS and ECLinPS-Lite devices from MOSAIC3 to MOSAIC5. The devices will continue to meet the same data sheet specifications. MOSAIC5 is a more advanced wafer fabrication process technology on which all ECLinPS Plus devices are currently produced. MOSAIC5 is a trench isolated, double epi, double poly, multi-layer metal, bipolar process similar to MOSAIC3, but has a minimum photolithography feature size of 0.7 um, as compared to MOSAIC3 which has a minimum photolithography feature size of 2 um. Additionally, MOSAIC5 utilizes an industry standard inorganic interlayer dielectric layer as compared to MOSAIC3 which has an organic polyimide interlayer dielectric layer.
|
| Key Items Affected by Change |
|
Wafer Process, Subcontractor Fab Site, Die shrink, Design Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2001-02-26 |
| Sample Info: |
|
available |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|