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Product Change Notification

Change Notification #   10399
Revision  
Type of Notification   PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Wafer Fab Technology Change for Selected ECLinPS Devices
Issue Date   2000-11-15
Affected Product Family   BROADBAND
Description   In order to better serve our customers, ON Semiconductor will increase wafer capacity by redesigning selected ECLinPS and ECLinPS-Lite devices from MOSAIC3 to MOSAIC5. The devices will continue to meet the same data sheet specifications. MOSAIC5 is a more advanced wafer fabrication process technology on which all ECLinPS Plus devices are currently produced. MOSAIC5 is a trench isolated, double epi, double poly, multi-layer metal, bipolar process similar to MOSAIC3, but has a minimum photolithography feature size of 0.7 um, as compared to MOSAIC3 which has a minimum photolithography feature size of 2 um. Additionally, MOSAIC5 utilizes an industry standard inorganic interlayer dielectric layer as compared to MOSAIC3 which has an organic polyimide interlayer dielectric layer.
Key Items Affected by Change   Wafer Process, Subcontractor Fab Site, Die shrink, Design Change
 
Key Milestones  
Effective Date:   2001-02-26
Sample Info:   available
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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