Product Change Notification
| Change Notification # |
|
20736 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
New Enlarged Clip Implementation in 30V Trench 6 SO8FL |
| Issue Date |
|
2015-01-15 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is notifying customers that it is fanning out an improved clip design used in the Assembly of the S08-FL package for 30V Trench 6 technology for better thermal performance. All new product releases currently incorporate this type of clip and products listed in this product bulletin are being converted after the proposed ship date. The new clip design enlarges the surface area contact to the source and does not require any modifications to the assembly processes or flows.
|
| Key Items Affected by Change |
|
ON Semiconductor Manufacturing Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2015-01-19 |
| Sample Info: |
|
Contact your local ON Semiconductor sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|