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Product Change Notification

Change Notification #   20736
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   New Enlarged Clip Implementation in 30V Trench 6 SO8FL
Issue Date   2015-01-15
Affected Product Family  
Description   ON Semiconductor is notifying customers that it is fanning out an improved clip design used in the Assembly of the S08-FL package for 30V Trench 6 technology for better thermal performance. All new product releases currently incorporate this type of clip and products listed in this product bulletin are being converted after the proposed ship date. The new clip design enlarges the surface area contact to the source and does not require any modifications to the assembly processes or flows.
Key Items Affected by Change   ON Semiconductor Manufacturing Assembly
 
Key Milestones  
Effective Date:   2015-01-19
Sample Info:   Contact your local ON Semiconductor sales office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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