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PCN Search Results

Part Number = NUP4201

PCN #

Title

Issued

Type

Action

16756 Qualification of ON Semiconductor’s Seremban assembly site as 2nd source for Hana Thailand for SC-88 & TSOP6 packaged devices 2011-11-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16522 Final Notification for Transfer of the Bipolar Power Epi Base, Bipolar Power Base Technologies, TVS (Transient Voltage Suppressor) Arrays and Ultrafast Rectifier from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2010-09-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16250 Initial Notification of Transfer of EMI Filters, Bidirectional ESD Diodes, Bipolar Power, Bidirectional TVS (Transient Voltage Suppressor) Diodes, TVS (Transient Voltage Suppressor) Arrays, Small Signal Schottky, Ultrafast Rectifier and Thyristor Surge Protection Devices (TSPD) products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2009-04-29 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16237 Final Notification for Transfer of Zener Products from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2009-04-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16133 Dual Source ISMF Wafer Fab Qualification for Zener Products 2008-07-15 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16081 Dual Source ISMF Wafer Fab Qualification for Zener Products 2007-12-21 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
16002 Final Notification for SO8-MCM Expansion to OSPI 2007-03-28 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15748O Final Notification for ISMF to ZR Wafer Fab Transfer 2007-03-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15506 Initial Notification of Qualification of OSPI for Assembly/Test of SO-8 MCM Package 2006-04-10 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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