Product Change Notification
| Change Notification # |
|
16658 |
| Revision |
|
C |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Sourcing MOSFET Die from United Microelectronics Corporation |
| Issue Date |
|
2013-04-11 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is already utilizing United Microelectronics Corp (UMC) for their High Cell Density (HD3e) and Trench (T2) MOSFET technology silicon platforms.
A fraction of the Trench (T1) MOSFET portfolio started to use UMC Wafer Fab July 2012 per FPCN #16658, FPCN #16658A and FPCN #16658B. With additional qualification and electrical characterization of this silicon platform, more T1 products will be built with Die sourced from the UMC. Wafer shipments of this group of products will begin in July 2013.
|
| Key Items Affected by Change |
|
ON Semiconductor Wafer Fab Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-07-11 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Brian Goodburn |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|