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Part Number = NTMS4807N

PCN #

Title

Issued

Type

Action

16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16146 Update Notification of FPCN16142: Copper Wire in the SO8 Packages for MOSFET Products 2008-08-29 UPDATE NOTIFICATION View PDF
16091 Copper Wire replacing Gold Wire in the SO8, TSOP6, ChipFET Packages for MOSFET Products 2008-01-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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