Product Change Notification
| Change Notification # |
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16391 |
| Revision |
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| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs |
| Issue Date |
|
2010-02-02 |
| Affected Product Family |
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| Description |
|
This is an Initial Process Change Notification.
ON Semiconductor is adding wafer fabrication capacity for their High Cell Density (HD3e) and Trench (T1 & T2) MOSFET technology silicon platforms. This will be accomplished by qualifying United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. By the middle of 2010, Wafer starts of both Trench and HD3e Silicon technologies will begin at UMC.
|
| Key Items Affected by Change |
|
Wafer Fabrication |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-06-02 |
| Sample Info: |
|
Contact Your Local On semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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