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Product Change Notification

Change Notification #   20480
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   T4 UDFN Single Copper Wire Conversion
Issue Date   2014-05-29
Affected Product Family  
Description   ON Semiconductor has qualified 1.3 mil copper wire bonding on UDFN2020 6L T4S pad design wafer technology Copper wire exhibits significantly better conductivity than gold or aluminium, enabling better heat dissipation and increased power ratings with thinner wire diameters. Intermetallic growth in copper bonds is significantly slower than in gold wire bonds. This results in lower electrical resistance, lower heat generation and, ultimately, increased bond reliability and device performance. This is important for high temperature application. Lower cost of copper wire makes it a competitive bonding wire alternative.
Key Items Affected by Change   Assembly
 
Key Milestones  
Effective Date:   2014-08-29
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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