Product Change Notification
| Change Notification # |
|
20480 |
| Revision |
|
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
T4 UDFN Single Copper Wire Conversion |
| Issue Date |
|
2014-05-29 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor has qualified 1.3 mil copper wire bonding on UDFN2020 6L T4S pad design wafer technology
Copper wire exhibits significantly better conductivity than gold or aluminium, enabling better heat dissipation and increased power ratings with thinner wire diameters.
Intermetallic growth in copper bonds is significantly slower than in gold wire bonds. This results in lower electrical resistance, lower heat generation and, ultimately, increased bond reliability and device performance. This is important for high temperature application.
Lower cost of copper wire makes it a competitive bonding wire alternative.
|
| Key Items Affected by Change |
|
Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-08-29 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|