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PCN Search Results

Part Number = NTLJF3117P

PCN #

Title

Issued

Type

Action

16658A Sourcing MOSFET Die from United Microelectronics Corporation 2012-03-16 UPDATE NOTIFICATION View PDF
16658A Sourcing MOSFET Die from United Microelectronics Corporation 2012-02-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16443O Copper Wire in the DFN Packages for MOSFET Products 2010-03-22 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16309A Trench and HD3e Die Transfer to ON Semiconductor in Aizu, Japan 2009-07-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16249 Trench Die Transfer to Aizu and Gresham Wafer Fab Facilities 2009-05-13 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16007O FPCN for Qualification of QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness 2007-04-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15665 Final PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 2006-10-27 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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