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PCN Search Results

Part Number = NTLGF3402P

PCN #

Title

Issued

Type

Action

16539O Wafer Capacity Expansion at United Microelectronics Corporation (UMC) 2010-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16443O Copper Wire in the DFN Packages for MOSFET Products 2010-03-22 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16191 4Q08 (4th QUARTER 2008) Product Discontinuance Notice 2008-12-19 PRODUCT DISCONTINUANCE View PDF
15174 Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban 2005-12-14 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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