PCN Search Results
Part Number = NTJS3157N
| 20382 |
1Q2014 Reactivation of previously EOL parts |
2014-02-13 |
UPDATE NOTIFICATION |
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PDF |
| 16658A |
Sourcing MOSFET Die from United Microelectronics Corporation |
2012-03-16 |
UPDATE NOTIFICATION |
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PDF |
| 16658A |
Sourcing MOSFET Die from United Microelectronics Corporation |
2012-02-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16667 |
Wire Size Change in SC88 Package on Gate Pad for MOSFET Products |
2011-06-24 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16391 |
Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs |
2010-02-02 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16389 |
4Q09 (4th QUARTER 2009) Product Discontinuance Notice |
2010-01-21 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16296 |
Copper Wire replacing Gold Wire for the SC70, SC75, SC88, SC89 Packages for MOSFET Products |
2009-07-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16140 |
H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-08-20 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16130 |
2Q08 (2nd QUARTER 2008) Product Discontinuance Notice |
2008-07-11 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16107 |
1Q08 (1st QUARTER 2008) Product Discontinuance Notice |
2008-04-04 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16015 |
Additional Trench Wafer Fabrication |
2007-05-22 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15744 |
Additional P Channel Trench Wafer Capacity at Aizu |
2007-03-15 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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