PCN Search Results
Part Number = NTHS5404
| 16539O |
Wafer Capacity Expansion at United Microelectronics Corporation (UMC) |
2010-12-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16391 |
Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs |
2010-02-02 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16305 |
Copper or Gold Wire for ChipFET MOSFET Products |
2009-07-27 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16091 |
Copper Wire replacing Gold Wire in the SO8, TSOP6, ChipFET Packages for MOSFET Products |
2008-01-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16004 |
H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2007-06-27 |
PRODUCT DISCONTINUANCE |
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PDF |
| 12926 |
MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-05-27 |
UPDATE NOTIFICATION |
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PDF |
| 12797 |
PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-04-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12760 |
Additional High Cell Density (HD3E) Wafer Fabrication Capacity in ASMC |
2003-02-25 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12652 |
Initial Notification for Wafer Capacity Expansion to ONPY for High Cell Density MOSFET Die |
2003-01-09 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12476 |
Final Notification - Additional HD3E Wafer Fabrication Capacity - MOSFET Products |
2002-09-06 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 12269 |
Final PCN - TMOS Wafer Fabrication Site Transfer from ESM to ON Semiconductor Aizu, Japan |
2002-01-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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