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PCN Search Results

Part Number = NTHD3102C

PCN #

Title

Issued

Type

Action

16658A Sourcing MOSFET Die from United Microelectronics Corporation 2012-03-16 UPDATE NOTIFICATION View PDF
16658A Sourcing MOSFET Die from United Microelectronics Corporation 2012-02-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16305 Copper or Gold Wire for ChipFET MOSFET Products 2009-07-27 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16091 Copper Wire replacing Gold Wire in the SO8, TSOP6, ChipFET Packages for MOSFET Products 2008-01-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16015 Additional Trench Wafer Fabrication 2007-05-22 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15744 Additional P Channel Trench Wafer Capacity at Aizu 2007-03-15 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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