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PCN Search Results

Part Number = NTHC5513

PCN #

Title

Issued

Type

Action

16539O Wafer Capacity Expansion at United Microelectronics Corporation (UMC) 2010-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16305 Copper or Gold Wire for ChipFET MOSFET Products 2009-07-27 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12760 Additional High Cell Density (HD3E) Wafer Fabrication Capacity in ASMC 2003-02-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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