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PCN Search Results

Part Number = NTGS3446

PCN #

Title

Issued

Type

Action

16539O Wafer Capacity Expansion at United Microelectronics Corporation (UMC) 2010-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16163 Copper Wire in the TSOP6 Package for MOSFET Products 2008-10-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16091 Copper Wire replacing Gold Wire in the SO8, TSOP6, ChipFET Packages for MOSFET Products 2008-01-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12760 Additional High Cell Density (HD3E) Wafer Fabrication Capacity in ASMC 2003-02-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12652 Initial Notification for Wafer Capacity Expansion to ONPY for High Cell Density MOSFET Die 2003-01-09 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12476 Final Notification - Additional HD3E Wafer Fabrication Capacity - MOSFET Products 2002-09-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12269 Final PCN - TMOS Wafer Fabrication Site Transfer from ESM to ON Semiconductor Aizu, Japan 2002-01-29 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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