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PCN Search Results

Part Number = NTD5802N

PCN #

Title

Issued

Type

Action

20210A Assy & Test Qualification of OSV for FET, Ultrafast & Bipolar packaged in DPAK 2013-09-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16618 Additional Wafer Capacity Expansion at United Microelectronics Corporation 2011-04-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16486 DPAK Package Case Outline Standardization to match JEDEC and Industry 2010-06-09 PRODUCT BULLETIN View PDF
16391 Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs 2010-02-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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