PCN Search Results
Part Number = NTD4813NH
| 20210A |
Assy & Test Qualification of OSV for FET, Ultrafast & Bipolar packaged in DPAK |
2013-09-24 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16583 |
1Q2011 – Update Notice for the reactivation of previously discontinued parts |
2011-04-08 |
UPDATE NOTIFICATION |
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PDF |
| 16569 |
4Q10 Product Discontinuance Notice |
2011-01-24 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16486 |
DPAK Package Case Outline Standardization to match JEDEC and Industry |
2010-06-09 |
PRODUCT BULLETIN |
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PDF |
| 16391O |
Wafer Capacity Expansion |
2010-03-18 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16391 |
Wafer Capacity Expansion for High Cell Density (HD3e) and Trench (T1 & T2) MOSFETs |
2010-02-02 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16100 |
Dpak Package Mold Compound Change – Discrete Products |
2008-02-26 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16041 |
DPAK Package Mold Compound Change |
2007-08-30 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15739 |
DPAK Package Added Capacity at Nantong Fujitsu |
2007-03-09 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15666 |
Added Capacity at Nantong Fujitsu for DPAK Packaged Low Voltage, N-Channel, Trench MOSFET Devices |
2006-11-02 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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