Product Change Notification
| Change Notification # |
|
16501 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper Wire replacing Gold Wire in ChipFet |
| Issue Date |
|
2010-07-20 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for their ChipFet packages. Discrete products built with bipolar transistor technology are represented by this Process Change Notice.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly Areas – Wire Bond |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-10-20 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Suei Huey Wong |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|