PCN Search Results
Part Number = NSR10F30NX
| 20088 |
Additional Test and Tape & Reel site for flip-chip DSN2 family from ON Semiconductor Seremban, Malaysia to existing external manufacturing site, JCAP, China. |
2013-05-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16968 |
Final Notification for the Wafer Fab Transfer of Flip Chip Schottky Diodes (DSN2 - 0402 and 0502 CSP) from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) |
2013-01-29 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16706 |
Conversion of the Tape and Reel Cover Tape for DSN2 (0201, 0402, 0502, 0603 sized) products from a UCT Cover Tape (Universal Cover Tape) to a HAA Cover Tape (Heat Activated Adhesive). |
2011-08-15 |
PRODUCT BULLETIN |
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