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Part Number = NSR01L30NXT5G

PCN #

Title

Issued

Type

Action

20088 Additional Test and Tape & Reel site for flip-chip DSN2 family from ON Semiconductor Seremban, Malaysia to existing external manufacturing site, JCAP, China. 2013-05-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16706 Conversion of the Tape and Reel Cover Tape for DSN2 (0201, 0402, 0502, 0603 sized) products from a UCT Cover Tape (Universal Cover Tape) to a HAA Cover Tape (Heat Activated Adhesive). 2011-08-15 PRODUCT BULLETIN View PDF
16674 Final Notification for Wafer Fab Transfer of Small Signal Schottky (DSN2 0201 CSP) from ON Semiconductor ZR Fab in Phoenix (USA) to ON Semiconductor ISMF Fab in Seremban (Malaysia) 2011-07-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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