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Product Change Notification

Change Notification #   16914
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products.
Issue Date   2012-10-05
Affected Product Family  
Description   To support ON Semiconductor’s Continuous Improvement efforts, ON Semiconductor will be converting the Tape and Reel Cover Tape of our wafer scale packaging (WSP) bare die products from HAA Cover Tape (Heat Activated Adhesive) to UCT Cold Seal Cover Tape (Universal Cover Tape) This will eliminated potential process inherent issue (torn tape, unsealing & stringing) due to heat seal process and provide a consistence peel force with small standard deviation.
Key Items Affected by Change   ON Semiconductor Assembly Site
 
Key Milestones  
Effective Date:   2012-10-25
Sample Info:  
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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