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PCN Search Results

Part Number = NCV51411

PCN #

Title

Issued

Type

Action

16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16007O FPCN for Qualification of QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness 2007-04-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15667 Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-10-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15333 Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL 2006-02-01 UPDATE NOTIFICATION View PDF
15001 : Standoff Height Dimension Change for the 16 Lead SOICW EPAD Package 2005-08-16 PRODUCT BULLETIN View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
14132 MSL Rating Change SOIC 16 Wide Package 2005-06-20 PRODUCT BULLETIN View PDF
13939 Transfer of Analog Bipolar Integrated Circuits Die Manufacturing from East Greenwich (USA) to Roznov (Czech Republic) 2005-03-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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