Product Change Notification
| Change Notification # |
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16853 |
| Revision |
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| Type of Notification |
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
NCP512/NCP612/NCP699 Family - Transfer Wafer fab from Aizu to Gresham |
| Issue Date |
|
2012-05-01 |
| Affected Product Family |
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| Description |
|
ON Semiconductor is pleased to announce the Wafer Fab qualification for the NCP512, NCP612, and NCP699 product families. These device families are currently qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and are now qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab.
The Gresham wafer fab is compliant to ISO9001:2008, ISO/TS16949:2009, and ISO14001:2004. The NCP512, NCP612, and NCP699 families run on the Aizu ACMOS1 process. The same ACMOS1 process has been transferred to and successfully qualified at the Gresham wafer fab. No device design changes have been made. Device performance is the same for Aizu and Gresham-sourced devices.
The NCP512, NCP612, and NCP699 families will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this fab qualification. No change to the device data sheets will be made.
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| Key Items Affected by Change |
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Wafer Fab Change |
| |
| Key Milestones |
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| Effective Date: |
|
2012-08-01 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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