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Product Change Notification

Change Notification #   16853
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   NCP512/NCP612/NCP699 Family - Transfer Wafer fab from Aizu to Gresham
Issue Date   2012-05-01
Affected Product Family  
Description   ON Semiconductor is pleased to announce the Wafer Fab qualification for the NCP512, NCP612, and NCP699 product families. These device families are currently qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and are now qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab. The Gresham wafer fab is compliant to ISO9001:2008, ISO/TS16949:2009, and ISO14001:2004. The NCP512, NCP612, and NCP699 families run on the Aizu ACMOS1 process. The same ACMOS1 process has been transferred to and successfully qualified at the Gresham wafer fab. No device design changes have been made. Device performance is the same for Aizu and Gresham-sourced devices. The NCP512, NCP612, and NCP699 families will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this fab qualification. No change to the device data sheets will be made.
Key Items Affected by Change   Wafer Fab Change
 
Key Milestones  
Effective Date:   2012-08-01
Sample Info:   Contact your local ON Semiconductor Sales Office or
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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