PCN Search Results
Part Number = NCP691
| 20948X |
Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia |
2015-07-10 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 20185A |
Qualification of Deca Technologies Philippines for Bump Processing |
2013-12-04 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16971 |
Qualification of Deca Philippines for Bump Post-Test Production (Wafer saw, visual inspection, Tape and Reel) |
2013-02-12 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16914 |
Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. |
2012-10-05 |
PRODUCT BULLETIN |
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PDF |
| 16441B |
NCS2200A, NCS2220A, NCP69x, NCP600 and NCV8560 Device Families Qualification at Gresham Wafer Fab |
2012-09-12 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16441 |
ACMOS and VHVIC 2nd Source Qualification to Gresham FAB |
2010-04-07 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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