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PCN Search Results

Part Number = NCP691

PCN #

Title

Issued

Type

Action

20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20185A Qualification of Deca Technologies Philippines for Bump Processing 2013-12-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16971 Qualification of Deca Philippines for Bump Post-Test Production (Wafer saw, visual inspection, Tape and Reel) 2013-02-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16914 Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. 2012-10-05 PRODUCT BULLETIN View PDF
16441B NCS2200A, NCS2220A, NCP69x, NCP600 and NCV8560 Device Families Qualification at Gresham Wafer Fab 2012-09-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16441 ACMOS and VHVIC 2nd Source Qualification to Gresham FAB 2010-04-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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