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PCN Search Results

Part Number = NCP623

PCN #

Title

Issued

Type

Action

20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
15505 Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion 2006-04-06 UPDATE NOTIFICATION View PDF
15339 Initial notice of intent to qualify Hana Semiconductor for Micro08, Micro10, and TSOP5 capacity expansion 2006-03-28 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15174 Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban 2005-12-14 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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