| 20948X |
Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia |
2015-07-10 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16780 |
NCP500, 511, 551 Family Wafer fab transfer from Aizu to Gresham: Correction |
2011-12-13 |
UPDATE NOTIFICATION |
View
PDF |
| 16780 |
NCP500, 502, 551 Family Wafer fab transfer from Aizu to Gresham |
2011-11-30 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16298 |
2Q09 (2nd QUARTER 2009) Product Discontinuance Notice |
2009-07-01 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16210 |
2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & |
2009-02-11 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16140 |
H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-08-20 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16055 |
Capacity Expansion for Devices Fabricated at XFAB Wafer Foundries |
2007-10-01 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16004 |
H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2007-06-27 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16007O |
FPCN for Qualification of QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness |
2007-04-06 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15713 |
QUAL NCP500 DFN6 2X2.2MM RECT HEAT SINK |
2007-01-11 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15505 |
Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion |
2006-04-06 |
UPDATE NOTIFICATION |
View
PDF |
| 15339 |
Initial notice of intent to qualify Hana Semiconductor for Micro08, Micro10, and TSOP5 capacity expansion |
2006-03-28 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15174 |
Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban |
2005-12-14 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15019 |
Device Marking Update/Standardization - TSOP5 Analog IC Package |
2005-09-16 |
PRODUCT BULLETIN |
View
PDF |
| 15016 |
Qualification of NCP500 DFN6 2x2.2 at NSEB site |
2005-09-07 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13716 |
Initial PCN for Qualification of QFN (2X2.2MM TO 8X8MM, 6 TO 52-LD) at ASAT China |
2004-10-22 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13509 |
2Q04 (2nd Quarter/2004) Product Discontinuance |
2004-06-30 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 13296 |
Initial PCN for Qualification of QFN (2X2.2MM to 8X8MM, 6 to 52LD) at ON Seremban |
2004-01-21 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13270 |
Initial PCN for Qualification of QFN (QUAD FLAT NO-LEAD) (2X2.2MM to 8X8MM, 6 to 52LD) at NSEB |
2003-12-16 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 13248 |
Lead Free Products Marking Identification |
2003-12-05 |
PRODUCT BULLETIN |
View
PDF |
| 12939 |
Marking Format Change for QFN 2X2.2 Package |
2003-05-30 |
PRODUCT BULLETIN |
View
PDF |
| 12926 |
MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-05-27 |
UPDATE NOTIFICATION |
View
PDF |
| 12797 |
PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION |
2003-04-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 11133 |
Update Notice for PCN#10664 |
2001-03-29 |
UPDATE NOTIFICATION |
View
PDF |