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Product Change Notification

Change Notification #   16231
Revision   A
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Copper wire bond for NCP1117LP family for the IC SOT223 package
Issue Date   2013-03-01
Affected Product Family  
Description   FPCN #16231 was issued on March 12, 2009 to begin using Copper wire on the IC SOT223 assembly line located in Seremban, Malaysia. The line has now been in production for several years using the Copper process. A new device was introduced shortly after the original FPCN was issued and was not included on the original FPCN.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2013-06-01
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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