Product Change Notification
| Change Notification # |
|
16231 |
| Revision |
|
A |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper wire bond for NCP1117LP family for the IC SOT223 package |
| Issue Date |
|
2013-03-01 |
| Affected Product Family |
|
|
| Description |
|
FPCN #16231 was issued on March 12, 2009 to begin using Copper wire on the IC SOT223 assembly line located in Seremban, Malaysia. The line has now been in production for several years using the Copper process. A new device was introduced shortly after the original FPCN was issued and was not included on the original FPCN.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-06-01 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|