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PCN Search Results

Part Number = MUN5311DW1

PCN #

Title

Issued

Type

Action

20774Z Henkel Green Compound Qual for SC88, SC88A, SC70, SC74, SC75, SOD923 pkgs 2015-03-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20349A Qualification of Niigata Fab (Japan) as the additional wafer source for Small Signal General Purpose Transistors and Bias Resistor Transistors 2014-11-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20349 Qualify Niigata FAB (Japan) for Bipolar Power Planar, BPT and GPT 2014-01-24 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16478O Copper Wire replacing Gold Wire in the SOT23, SC88/SC88A, SC70, SC74, SC75, SOD123, SOD523, SOD723, SOT723, SOD923 Packages. 2010-05-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16266 Copper Wire replacing Gold Wire in the SOT23, SOD123, SOD323, TSOP6, SOT223, and SC88/SC88A Packages 2009-06-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12926 MODIFICATION OF PCN # 12797, PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-05-27 UPDATE NOTIFICATION View PDF
12797 PB (LEAD) FREE LEAD FINISH/PLATING CONVERSION 2003-04-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12462 Final Notification for Qualification of Additional Assembly/Test Sites for ON Semiconductor 2002-10-03 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11628 Assembly/Test Site Change for SC88 Package 2001-08-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10184 New Source of Cover Tape Qualified 2000-05-30 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10153 Device Code Marking Orientation Change 2000-03-15 PRODUCT BULLETIN View PDF
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