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Part Number = MBRB1045

PCN #

Title

Issued

Type

Action

16587O Qualification of Nantong Fujitsu Microelectronics Co.,Ltd. for Assembly/Test of D2PAK (TO-263) Bipolar Power Transistors, Power Schottky and Ultrafast Rectifiers 2011-03-07 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16498 2Q10 2nd QUARTER 2010 Product Discontinuance Notice 2010-07-07 PRODUCT DISCONTINUANCE View PDF
16102 Final Notification if ISMF Wafer Fab Qualification for Schottky Rectifier Products 2008-02-20 UPDATE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
13326 Phase 1 Qualification of Schottky Rectifier Wafer Production in LiON Microelectronics,LLC 2004-03-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13211 Qualification of Schottky Rectifier Wafer Production in LiON Microelectronics, LLC. 2003-11-20 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11940 Final Notification - Qualification of Alternate Assembly/Test Sites 2001-10-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11696 2nd Update to 10570: Non Active Area Die Shrink for Schottky Rectifiers 2001-08-31 UPDATE NOTIFICATION View PDF
11678 Initial Notification - Qualification of Alternate Assembly/Test Sites for Power Products 2001-08-14 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11390 D2PAK (Surface Mount TO-220) Leadframe Enhancement 2001-05-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10570 Non Active Area Die Shrink for Schottky Rectifiers 2001-01-22 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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