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PCN Search Results

Part Number = BC858CL

PCN #

Title

Issued

Type

Action

16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16049 Final Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-10-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16009 Initial Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-05-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15645 3rd QUARTER 2006 Product Discontinuance Notice 2006-10-06 PRODUCT DISCONTINUANCE View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15532 45 DAYS TO ORDER DEVICES LISTED IN PRODUCT DISCONTINUANCE NOTICE 15180 2006-05-15 UPDATE NOTIFICATION View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
11148 Final Notification for SOT23 Capacity Expansion to PSI 2001-07-04 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10542 SOT23 Assembly/Test Qualification at KEC-T 2000-12-27 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10232 Small Signal Wafer Size Change 2000-07-21 PRODUCT BULLETIN View PDF
10184 New Source of Cover Tape Qualified 2000-05-30 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10149 Small Signal Wafer Process Conversion 2000-03-15 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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