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PCN Search Results

Part Number = BC856BL

PCN #

Title

Issued

Type

Action

20349A Qualification of Niigata Fab (Japan) as the additional wafer source for Small Signal General Purpose Transistors and Bias Resistor Transistors 2014-11-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20349 Qualify Niigata FAB (Japan) for Bipolar Power Planar, BPT and GPT 2014-01-24 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16478O Copper Wire replacing Gold Wire in the SOT23, SC88/SC88A, SC70, SC74, SC75, SOD123, SOD523, SOD723, SOT723, SOD923 Packages. 2010-05-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16389 4Q09 (4th QUARTER 2009) Product Discontinuance Notice 2010-01-21 PRODUCT DISCONTINUANCE View PDF
16134 SOT-23 Possible Adhesion Issue using Glue Mount Process 2008-07-11 PRODUCT BULLETIN View PDF
16049 Final Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-10-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16009 Initial Notification for Gold wire changing to Copper wire on SOT-23 commodity parts 2007-05-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15590 2Q06 (2nd QUARTER 2006) Product Discontinuance Notice 2006-06-30 PRODUCT DISCONTINUANCE View PDF
15571 Final Notification for ISMF to ZR Wafer Fab Transfer 2006-06-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15013 Initial Notification for ISMF to ZR Wafer Fab Transfer 2005-09-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
10542 SOT23 Assembly/Test Qualification at KEC-T 2000-12-27 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10339 SOT23/SC59 Part Number Change 2000-10-23 PRODUCT BULLETIN View PDF
10232 Small Signal Wafer Size Change 2000-07-21 PRODUCT BULLETIN View PDF
10148 HYSOL Molding Compound and AFW(American Fine Wire) Change 2000-03-17 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10149 Small Signal Wafer Process Conversion 2000-03-15 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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