Power Solutions from ON Semiconductor
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Medical Imaging

X-rays have by far been the most important medical imaging diagnostic tool since their discovery more than 100 years ago. But newer technologies are rapidly reshaping the medical imaging marketplace. Current trends in imaging include higher resolution, 3D imaging, and faster image capture time. Today, for example, doctors routinely view high resolution, 3-dimensional displays of beating hearts to help diagnose cardiovascular disease.

Such developments in the imaging market put increasing demands on the underlying electronic components, with faster processing and higher resolution coupled with more sensing and transmitter channels. The shear amount of sensor inputs and higher acquisition speeds means that low power becomes even more important in these applications.

Our technologies and design teams are optimized to handle these challenges. With its 0.35µm I3T process family, we offer 0.35µm CMOS digital packing density and analog speed, integrated together with drivers that can handle up to 90V of output. For even higher power applications, the I2T process combines up to 100V output capability with 0.7µm CMOS digital packing density. The 0.5µm C5 process provides high analog precision capability with 3.3-40 Volt capabilities. All these process technologies offer new exciting opportunities for integration of transducer drivers together with a sensor interface.


XPressArray®-II Ideal for Conversions

To further reduce cost and power consumption, traditional FGPA designs can be converted and replaced with other more efficient technologies. Our XPressArray-II structured ASIC offerings are ideally suited for bringing lower cost and power consumption to imaging applications.

XPressArray-II offers customers fast turnaround access to 0.15µm performance digital logic at a fraction of the cost. XPressArray-II offers a true drop-in replacement for most Xilinx and Altera FPGAs, making it the industry's lowest cost ASIC conversion solution. The result is an easy path to cost reductions for OEMs who want to combine the flexibility of FPGA prototyping with a roadmap to ASICs for final production.

A diverse mix of fine geometry combined with high-voltage processes ensures that we can meet the sensor interface requirements of the most demanding medical imaging applications.