Pocatello, ID USA

Manufacturing Facility

Wafer fab with over 50,000 square feet of clean room space, located on a 33 acre campus with over 550,000 square feet of building space.

• Fab: 8-inch
  
  
• Production: 0.35 µm to 1.5 µm Analog CMOS, BCD, Advanced Discrete, and Custom Technologies
  
  
• Acquired: AMI Semiconductor in 2008
  
  
• Certifications:

- AS 9100 Rev. B
- C-TPAT
- ISO 14001:2004
- ISO 9001:2008
- ISO / TS 16949:2009
- MIL-PRF-38535
- MIL-PRF-19500
- STACK
- Trusted Foundry Accreditation
- Green Partner Certification

• Careers

Design Center

• Established: The Idaho Wireless Mixed-Signal Design Center (IDWM) was formed in the 1990s as a design center for AMI Semiconductor focused on wireless mixed-signal & mixed-signal design. In March 2008, ON Semiconductor obtained the design center through the acquisition of AMIS.
  
  
• Focus End Markets: Wireless Mixed-Signal Designs, Industrial and Automotive Mixed Signal Designs
  
  
• Product Focus: State-of-the-art Mixed-Signal Application-Specific Integrated Circuits (ASICs & ASSPs)
  
  
• Careers