Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Base part	Part	Status	Exempt	Mold Compound-Black								Lead Frame			Die Attach							Plating			Die		Wire Bond			Ceramic Substrate							Chip Parts														Heat Sink			Solder Ball					TOTAL
				Brominated epoxy resin [%]	Phenolic Resin [%]	Epoxy Phenol Resin [%]	Antimony Trioxide (Sb2O3) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Other Epoxy resins [%]	Tin (Sn) [%]	Other Metal Oxide [%]	Antimony (Sb) [%]	Antimony Pentoxide (Sb2O5) [%]	Weight [mg]	Tin (Sn) [%]	Nickel (Ni) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Bisphenol A_Epichlorohydrin Polymer [%]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Barium Sulfate (BaSO4) [%]	Aluminum (Al) [%]	Weight [mg]	Silver (Ag) [%]	Epoxy resins [%]	Tin (Sn) [%]	Magnesium Monoxide (MgO) [%]	Silica Amorphous (SiO2) [%]	Ceramic [%]	Phenolic resins [%]	Palladium (Pd) [%]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Lead Oxide (PbO) [%]	Copper (Cu) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Antimony (Sb) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	1309-64-4	60676-86-0	29690-82-2	14808-60-7	n/a	7440-31-5	7440-50-8	n/a	7440-22-4	proprietary data	7440-31-5	proprietary data	7440-36-0	1314-60-9	n/a	7440-31-5	7440-02-0	n/a	7440-21-3	n/a	7440-21-3	7429-90-5	n/a	25068-38-6	1344-28-1	7440-02-0	7440-50-8	7727-43-7	7429-90-5	n/a	7440-22-4	129915-35-1	7440-31-5	1309-48-4	7631-86-9	12013-47-7, 12047-27-7	proprietary data	7440-05-3	1344-28-1	7440-02-0	1317-36-8	7440-50-8	14808-60-7	n/a	7440-22-4	7440-50-8	n/a	7440-22-4	7440-31-5	7440-36-0	7440-50-8	n/a	n/a
STK551U3A2A-E	STK551U3A2A-E	Last Shipments	7c	2	6	2	3	10	7	70	9518.32	0.06	99.94	843.67	68.71	15.16	9.88	3.83	0.91	1.51	1.77	50	50	11.8	100	36.19	0.01	99.99	46.74	1.65	6.66	0.16	6.57	0.02	84.94	4828.54	2.2	0.77	2.82	0.2	1.41	16.18	0.1	0.01	64.02	4.55	0.11	6.69	0.94	52.8	0.98	99.02	1315.9	3.1	96.16	0.01	0.73	44.27	16700.0

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.