Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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11 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black										Lead Frame											Die Attach											Die Attach Epoxy			Die Attach Tape						Plating					Die		Wire Bond - Au		Lead Frame plating		TOTAL
				Epoxy resin [%]	Epoxy and Phenolic Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Fatty acids, C18-unsatd., dimers, polymers with epichlorhydrin [%]	2,2'-[[2-(oxiranylmethoxy)-1,3-phenylene]bis(methylene)]bisoxirane [%]	4-Methyl-2-Phenyl-1H-Imidazole [%]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Aluminum Trioxide (Al2O3) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Epoxy resin [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Silicon Dioxide [%]	Acrylic AE Copolymer [%]	Formaldehyde, polymer with 4,4-(1-methylethylidene)bisphenol [%]	Ortho Cresol Novolac Resin [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Silver (Ag) [%]	Weight [mg]	Weight [mg]
				proprietary data	40216-08-8	proprietary data	29690-82-2	7631-86-9	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7439-95-4	7440-31-5	7440-66-6	7440-47-3	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68475-94-5	13561-08-5	827-43-0	129915-35-1	7440-22-4	129915-35-1	54208-63-8	1344-28-1	9003-35-4	n/a	proprietary data	1344-28-1	n/a	7631-86-9	58152-79-7	25085-75-0	29690-82-2	9003-36-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-22-4	n/a	n/a
NCS2200A	NCS2200AMUT1G	Active	Y	7		7		15	0.5		70.5		10			0.25	0.22	0.25				99.28		6.97					32				68		0.45											3.2	95.7	1.1	0.71	100	0.2	100	1.67			20.0
NCS2200	NCS2200SN1T1G	Active	Y	5		5	2		0.5		87.5		7.34	1.22			0.12				2.35	96.28	0.03	5.78						80		20			0.11										100				0.39	100	0.42	100	0.04			14.08
NCS2200	NCS2200SN1T1GH	Obsolete	Y	No data available
NCS2200	NCS2200SN2T1G	Active	Y	5		5	2		0.5		87.5		7.34	1.22			0.12				2.35	96.28	0.03	5.78						80		20			0.11										100				0.39	100	0.42	100	0.04			14.08
NCS2200	NCS2200SQ2T2G	Active	Y	5		5	2		0.5		87.5		10							36.3	50.2	13.5		2.35												65	35	0.15							100				0.13	100	0.67	100	0.08	100	0.05	13.43
NCS2200	NCS2200SQ2T2GH	Obsolete	Y	No data available
NCS2200	NCS2200SQLT1G	Last Shipments	Y		8				0.5	2	86.5	3	10	1		0.25	0.22	0.25				98.28		6.97						75	25				0.45										100				0.71	100	0.39	100	1.67			20.19
NCS2200A	NCV2200AMUTBG	Active	Y	7		7		15	0.5		70.5		10.1		0.15				0.65	3		96.2		6.97															50	15	14	7	14	0.45		3.2	95.7	1.1	0.71	100	0.1	100	1.67			20.0
NCS2200	NCV2200SN1T1G	Active	Y	5		5	2		0.5		87.5		7.34	1.22			0.12				2.35	96.28	0.03	5.78						80		20			0.11										100				0.39	100	0.42	100	0.04			14.08
NCS2200	NCV2200SN2T1G	Active	Y	5		5	2		0.5		87.5		7.34	1.22			0.12				2.35	96.28	0.03	5.78	30	30	30	9						1	0.11										100				0.39	100	0.42	100	0.04			14.08
NCS2200	NCV2200SQ2T2G	Active	Y	5		5	2		0.5		87.5		10							36.3	50.2	13.5		2.35												65	35	0.15							100				0.13	100	0.67	100	0.08	100	0.05	13.43

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.