Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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12 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame						Die Attach													Plating		Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Fatty acids, C18-unsatd., dimers, polymers with epichlorhydrin [%]	2,2'-[[2-(oxiranylmethoxy)-1,3-phenylene]bis(methylene)]bisoxirane [%]	4-Methyl-2-Phenyl-1H-Imidazole [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Phenolic Resin [%]	Inorganic filler [%]	Dicyandiamine [%]	Formaldehyde Polymer [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68475-94-5	13561-08-5	827-43-0	7440-22-4	129915-35-1	54208-63-8	proprietary data	proprietary data	461-58-5	9003-36-5	9003-35-4	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCS20032	NCS20032DMR2G	Active	Y	5	5	2		0.5	87.5	14.96	2.5	0.1	2.4	95		14.26	2.5				84.5			2.5	2.5	0.5	7.5		0.91	100	0.38	100	0.31	100	0.3	31.12
NCS20032	NCS20032DR2G	Active	Y	5	2	2.5		0.5	90	29.77	2.14	0.13	2.4	95.25	0.08	37.61	10				80						10		0.1	100	1.89	100	0.17	100	0.19	69.73
NCS20032	NCS20032DTBR2G	Active	Y				10.5		89.5	9.5			1.9	98.1		10.38					75	25							0.66	100	1.06	100	1	100	0.1	22.7
NCS20034	NCS20034DR2G	Active	Y	5	2	2.5		0.5	90	43.93	1.2	0.12	2.35	96.3	0.03	69.62	10				80						10		0.18	100	3.27	100	0.48	100	0.12	117.6
NCS2003	NCS2003ASN2T1G	Active	Y	5	5	2		0.5	87.5	7.34	1.22	0.12	2.35	96.28	0.03	5.78					80		20						0.11	100	0.39	100	0.42	100	0.04	14.08
NCS2003	NCS2003SN2T1G	Active	Y	5	5	2		0.5	87.5	7.34	1.22	0.12	2.35	96.28	0.03	5.78	30	30	30	9								1	0.11	100	0.39	100	0.42	100	0.04	14.08
NCS2003	NCS2003XV53T2G	Obsolete	Y	No data available
NCS20032	NCV20032DMR2G	Active	Y	5	5	2		0.5	87.5	14.96	2.5	0.1	2.4	95		14.26					75	25							0.91	100	0.38	100	0.31	100	0.3	31.12
NCS20032	NCV20032DR2G	Active	Y	5	2	2.5		0.5	90	29.77	2.14	0.13	2.4	95.25	0.08	37.61	10				80						10		0.1	100	1.89	100	0.17	100	0.19	69.73
NCS20032	NCV20032DTBR2G	Active	Y				10.5		89.5	9.5			1.9	98.1		10.38					75	25							0.66	100	1.06	100	1	100	0.1	22.7
NCS20034	NCV20034DR2G	Active	Y	5	2	2.5		0.5	90	43.43	1.1	0.2	2.6	96.1		69.62					75	25							4.44	100	3.27	100	0.98	100	0.31	122.05
NCS2003	NCV2003SN2T1G	Active	Y	5	5	2		0.5	87.5	7.34	1.22	0.12	2.35	96.28	0.03	5.78	30	30	30	9								1	0.11	100	0.39	100	0.42	100	0.04	14.08

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.