Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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18 Non-hybrid devices found
Non-hybrid devices
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1 - 18 of 18
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Weight [mg]
Cu [%]
Fe [%]
Ag [%]
Zn [%]
Cr [%]
P [%]
Sn [%]
Weight [mg]
Ag [%]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Pd [%]
Au [%]
Ni [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
n/a
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7440-47-3
7723-14-0
7440-31-5
n/a
7440-22-4
1344-28-1
129915-35-1
n/a
7440-31-5
7440-05-3
7440-57-5
7440-02-0
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP752
NCP752AMX18TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752AMX28TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752AMX30TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752AMX33TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752ASN18T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752ASN28T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752ASN30T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752ASN33T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752BMX18TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752BMX28TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752BMX30TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752BMX33TCG
Active
Y
86.50
7.00
5.00
1.50
1.27
99.28
0.22
0.25
0.25
1.90
40.00
60.00
0.18
2.40
9.50
88.10
0.03
100.00
0.25
100.00
0.01
3.64
NCP752
NCP752BSN18T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752BSN28T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752BSN30T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752
NCP752BSN33T1G
Active
Y
89.50
10.50
7.34
96.28
2.35
1.22
0.12
0.03
5.78
75.00
25.00
0.11
100.00
0.39
100.00
0.42
100.00
0.04
14.08
NCP752MX00TCG
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP752SN00T1G
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .