Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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16 Non-hybrid devices found
Non-hybrid devices
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1 - 16 of 16
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Fused silica [%]
Epoxy + Phenol Resin [%]
Weight [mg]
Cu [%]
Fe [%]
Weight [mg]
Ag [%]
Epoxy [%]
Weight [mg]
Sn [%]
Pb [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
60676-86-0
n/a
n/a
7440-50-8
7439-89-6
n/a
7440-22-4
129915-35-1
n/a
7440-31-5
7439-92-1
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP662
NCP662SQ15T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ15T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ18T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ18T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ25T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ25T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ27T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ27T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ28T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ28T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ30T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ30T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ33T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ33T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ50T1
Last Shipments
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
80.00
20.00
1.19
100.00
0.01
100.00
0.01
7.09
NCP662
NCP662SQ50T1G
Active
Y
89.50
10.50
4.49
88.10
11.90
1.31
75.00
25.00
0.08
100.00
1.19
100.00
0.01
100.00
0.01
7.09
Page size:
ALL
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .