Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
Download:
Excel
Use~ for the exact search match (i.e. ~NTS2101PT1).
17 Non-hybrid devices found
Non-hybrid devices
Page size:
ALL
25
50
75
100
200
400
1 - 17 of 17
[
1
]
Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Fe [%]
Ag [%]
Zn [%]
Weight [mg]
Ag [%]
Epoxy [%]
Weight [mg]
Sn [%]
Pb [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
9003-35-4
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
1333-86-4
n/a
7440-50-8
7439-89-6
7440-22-4
7440-66-6
n/a
7440-22-4
129915-35-1
n/a
7440-31-5
7439-92-1
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP623DM-28R2G
Obsolete
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623DM-30R2G
Obsolete
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623DM-33R2
Obsolete
89.50
10.50
14.96
95.00
2.40
2.50
0.10
14.26
75.00
25.00
0.91
80.00
20.00
0.38
100.00
0.31
100.00
0.65
31.47
NCP623DM-33R2G
Obsolete
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623DM-40R2
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623DM-40R2G
Obsolete
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623DM-50R2
Obsolete
89.50
10.50
14.96
95.00
2.40
2.50
0.10
14.26
75.00
25.00
0.91
80.00
20.00
0.38
100.00
0.31
100.00
0.65
31.47
NCP623DM-50R2G
Obsolete
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623
NCP623MN-25R2G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP623
NCP623MN-28R2G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP623
NCP623MN-30R2G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP623MN-33R2
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623
NCP623MN-33R2G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP623MN-40R2
Obsolete
No data available – please send request to Product-Env-Steward@onsemi.com
NCP623
NCP623MN-40R2G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP623MN-50R2
Obsolete
86.50
7.00
5.00
1.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
90.00
10.00
0.71
100.00
0.20
100.00
1.67
20.00
NCP623
NCP623MN-50R2G
Active
Y
3.00
86.50
8.00
2.00
0.50
10.00
71.00
1.10
27.90
6.97
75.00
25.00
0.45
100.00
0.71
100.00
0.20
100.00
1.67
20.00
Page size:
ALL
25
50
75
100
200
400
1 - 17 of 17
[
1
]
Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .