Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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16 Non-hybrid devices found
Non-hybrid devices
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1 - 16 of 16
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Fused silica [%]
Epoxy + Phenol Resin [%]
Weight [mg]
Cu [%]
Fe [%]
Ag [%]
Weight [mg]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
60676-86-0
n/a
n/a
7440-50-8
7439-89-6
7440-22-4
n/a
1344-28-1
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP605
NCP605MN15T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MN18T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MN25T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MN28T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MN30T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MN33T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MN50T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP605MNADJT2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN15T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN18T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN25T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN28T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN30T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN33T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MN50T2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
NCP605
NCP606MNADJT2G
Active
Y
91.00
9.00
14.80
95.80
2.20
2.00
5.86
32.00
68.00
0.24
100.00
1.22
100.00
0.99
100.00
0.21
23.32
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .