Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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13 Non-hybrid devices found
Non-hybrid devices
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1 - 13 of 13
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Ortho Cresol Novolac Resin [%]
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Ni [%]
Ag [%]
Zn [%]
Au [%]
Sn [%]
Si [%]
Weight [mg]
Ag [%]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
29690-82-2
9003-35-4
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
1333-86-4
n/a
7440-50-8
7440-02-0
7440-22-4
7440-66-6
7440-57-5
7440-31-5
7440-21-3
n/a
7440-22-4
1344-28-1
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP4688
NCP4688DMU12TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DMU15TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DMU18TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DMU25TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DMU28TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DMU30TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DMU33TCG
Active
86.5
7.0
5.0
1.5
0.97351
94.7
4.3
1.0
0.254
40.0
60.0
0.01
100.00
0.14249
100.00
0.02
1.40000
NCP4688
NCP4688DSN12T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4688
NCP4688DSN15T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4688
NCP4688DSN18T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4688
NCP4688DSN25T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4688
NCP4688DSN28T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4688
NCP4688DSN33T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .