Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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17 Non-hybrid devices found
Non-hybrid devices
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1 - 17 of 17
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Fused silica [%]
Epoxy + Phenol Resin [%]
Weight [mg]
Cu [%]
Fe [%]
Ag [%]
Weight [mg]
Ag [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
60676-86-0
n/a
n/a
7440-50-8
7439-89-6
7440-22-4
n/a
7440-22-4
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP4680
NCP4680DMX10TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX12TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX15TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX18TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX23TCG
Active
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX28TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX30TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DMX33TCG
Active
Y
No data available – please send request to Product-Env-Steward@onsemi.com
NCP4680
NCP4680DSQ08T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ09T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ12T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ15T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ18T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ25T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ28T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ30T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4680
NCP4680DSQ33T1G
Active
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .