Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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15 Non-hybrid devices found
Non-hybrid devices
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1 - 15 of 15
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Ortho Cresol Novolac Resin [%]
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Fe [%]
Ni [%]
Ag [%]
Zn [%]
Au [%]
Sn [%]
Si [%]
Weight [mg]
Ag [%]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
29690-82-2
9003-35-4
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
1333-86-4
n/a
7440-50-8
7439-89-6
7440-02-0
7440-22-4
7440-66-6
7440-57-5
7440-31-5
7440-21-3
n/a
7440-22-4
1344-28-1
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP4589
NCP4589DMX12TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4589
NCP4589DMX18TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4589
NCP4589DMX28TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4589
NCP4589DMX30TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4589
NCP4589DMX33TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4589
NCP4589DSN12T1G
Active
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4589
NCP4589DSN18T1G
Active
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4589
NCP4589DSN25T1G
Active
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4589
NCP4589DSN30T1G
Active
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4589
NCP4589DSN33T1G
Active
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4589
NCP4589DSQ12T1G
Last Shipments
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4589
NCP4589DSQ18T1G
Last Shipments
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4589
NCP4589DSQ25T1G
Last Shipments
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4589
NCP4589DSQ30T1G
Last Shipments
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
NCP4589
NCP4589DSQ33T1G
Last Shipments
Y
88.6
11.4
3.35
95
2
3
2.61
75
25
0.013
100
0.17
100
0.342
100
0.02
6.505
Page size:
ALL
25
50
75
100
200
400
1 - 15 of 15
[
1
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .