Material Composition
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11 Non-hybrid devices found
Non-hybrid devices
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1 - 11 of 11
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Mold Compound
Leadframe
Die Attach
Plating
Die
Wire Bond
TOTAL
Ortho Cresol Novolac Resin [%]
Phenolic Resin [%]
Fused silica [%]
Epoxy + Phenol Resin [%]
Bisphenol A, Epichlorohydrin polymer [%]
AlHydroxide [%]
Carbon black [%]
Weight [mg]
Cu [%]
Ni [%]
Ag [%]
Zn [%]
Au [%]
Sn [%]
Si [%]
Weight [mg]
Ag [%]
Al Oxide [%]
Epoxy [%]
Weight [mg]
Sn [%]
Weight [mg]
Si [%]
Weight [mg]
Au [%]
Weight [mg]
Weight [mg]
29690-82-2
9003-35-4
60676-86-0
n/a
90598-46-2 25068-38-6
21645-51-2
1333-86-4
n/a
7440-50-8
7440-02-0
7440-22-4
7440-66-6
7440-57-5
7440-31-5
7440-21-3
n/a
7440-22-4
1344-28-1
129915-35-1
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP4587
NCP4587DMX12TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4587
NCP4587DMX18TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4587
NCP4587DMX28TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4587
NCP4587DMX30TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4587
NCP4587DMX31TCG
Active
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4587
NCP4587DMX33TCG
Active
Y
86.5
7.0
5.0
1.5
0.87896
94.7
4.3
1.0
0.278
40.0
60.0
0.021
100.00
0.16204
100.00
0.01
1.35000
NCP4587
NCP4587DSN12T1G
Last Shipments
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4587
NCP4587DSN18T1G
Last Shipments
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4587
NCP4587DSN28T1G
Last Shipments
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4587
NCP4587DSN30T1G
Last Shipments
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
NCP4587
NCP4587DSN33T1G
Last Shipments
Y
10.00
5.00
74.97
10.00
0.03
8.72
92.1
3.2
2.5
0.25
1.25
0.7
5.80
75.00
25.00
0.03
100.0
0.20
100.00
0.24
100.00
0.01
15.00
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ALL
25
50
75
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1 - 11 of 11
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use
of Mercury, Hexavalent Chromium, Cadmium, PBBE
or PBDE (5 of the 6 RoHS banned substances) in
this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .