Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame					Die Attach			Plating		Die		Wire Bond - Au		Protection coat		Solder Ball				Under Bump Metal			TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Epoxy resins [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Polyimide [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	n/a	7440-22-4	129915-35-1	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	proprietary data	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-32-6	7440-50-8	n/a	n/a
NCP2820	NCP2820AFCT2G	Obsolete	Y	No data available
	NCP2820FCT1	Obsolete		No data available
NCP2820	NCP2820FCT1G	Last Shipments	Y																	100	1.853633			100	0.015447	2.6	96.8	0.6	0.941058	0.68	99.32	0.037914	2.848052
NCP2820	NCP2820FCT2G	Obsolete	Y	No data available
NCP2820	NCP2820MUTBG	Last Shipments	Y	7	7	15	0.5	70.5	15	19.7	0.1	1.5	78.7	12.41	75	25	0.79	100	0.6	100	0.3	100	0.9										30.0
NCP2820	NCV2820MUTBG	Active	Y	7	7	15	0.5	70.5	15	19.7	0.1	1.5	78.7	12.41	75	25	0.79	100	0.6	100	0.3	100	0.9										30.0

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.