Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

4 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 4 of 4

Base part	Part	Status	HF	Mold Compound-Black									Lead Frame							Die Attach							Plating					Die		Wire Bond - Au		Lead Frame plating		TOTAL
				Epoxy resin [%]	Epoxy and Phenolic Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Phenolic Resin [%]	Inorganic filler [%]	Dicyandiamine [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Silver (Ag) [%]	Weight [mg]	Weight [mg]
				proprietary data	40216-08-8	proprietary data	29690-82-2	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-22-4	7440-31-5	7440-66-6	7440-47-3	7439-89-6	7440-50-8	n/a	proprietary data	7440-22-4	proprietary data	proprietary data	461-58-5	9003-36-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-22-4	n/a	n/a
NB3H83905C	NB3H83905CDR2G	Active		5		2	2.5	0.5		90		55.11	1		0.2		2.6	96.2	75.92	10	80				10	4.85	100				3.73	100	2.73	100	0.35			142.69
NB3H83905C	NB3H83905CDTG	Active		5		2	2.5	0.5		90		19					1.9	98.1	20.76	10	80				10	1.32		7.6	91	1.4	2.12	100	2	100	0.2			45.4
NB3H83905C	NB3H83905CDTR2G	Active		5		2	2.5	0.5		90		19					1.9	98.1	20.76	10	80				10	1.32		7.6	91	1.4	2.12	100	2	100	0.2			45.4
NB3H83905C	NB3H83905CMNG	Active	Y		8			0.5	2	86.5	3	17.47		0.25	0.22	0.25		99.28	18.25	2.5	84.5	2.5	2.5	0.5	7.5	0.26	100				0.26	100	2.73	100	0.22	100	0.2	39.39

Page size:

1 - 4 of 4

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.